Flip chip bonding equipment KMP400

Semi-automatic flip chip bonding of large-area devices is possible.

Electronic Science and Engineering Department
Photonics and Electronics Science and Engineering Center

(1) Individuals who are faculty members or students of Kyoto University (hereinafter referred to as "the University") and are engaged in research and development related to photonic crystal surface-emitting lasers for the purpose of such research and development.
(2) Individuals who are faculty members or students of the University, excluding those mentioned in the preceding item, and are engaged in research and development related to photonic crystal surface-emitting lasers for the purpose of such research and development.
(3) Individuals affiliated with a country, local government entity, national university corporation, university joint-use institution corporation, independent administrative corporation, or a legal entity or organization that conducts education and research as its business purpose, and are engaged in research and development related to photonic crystal surface-emitting lasers for the purpose of such research and development.
(4) Individuals engaged in research and development in companies or other organizations for the purpose of research and development related to photonic crystal surface-emitting lasers.
(5) Any other individuals deemed appropriate by the person in charge of management.

Photonics and Electronics Science and Engineering Center
Menaka De Zoysa
075-383-2319
dezoysa.menaka.6u*kyoto-u.ac.jp
※Please change 「*」 to 「@」 and send.